Kingford

  Abstract: Circuit board assembly refers to the process of mounting, inserting and soldering bare PCB components. The production process of PCB Assembly board needs to go through a series of processes to complete the production. This article will introduce the various processes of circuit board assembly production by Kingford . The PCBA production process can be divided into several major processes, SMT soldering processing → DIP plug-in processing → circuit board assembly testing → finished product assembly → Quality control inspection. Table of Contents 1. SMT soldering processing 2. DIP plug-in processing 3. Circuit board assembly testing 4. Finished product assembly 5. Quality control inspection   1. SMT soldering processing The process of SMT patch processing is: solder paste mixing → solder paste printing → SPI → placement → reflow soldering → AOI → rework 1) Solder paste mixing After the solder paste is taken out of the refriger...

  Abstract: EMC is about how to solve the problem of how electronic devices interfere with other devices or prevent external devices from generating electromagnetic field interference to their own electronic devices. In PCB EMC wiring design, especially high-speed circuit design, you must consider the electromagnetic compatibility of the circuit, otherwise, your product may not pass the 3C standard. Today we will talk about the specific design details and issues that need to be paid attention to in the PCB layout design of electromagnetic compatibility (EMC). Table of content 1. PCB EMC wiring design skills 2. PCB EMC wiring design rules     2.1 Wiring separation     2.2 Protection and shunt line     2.3 Power cord design     2.4 Ground wire design     2.5 Signal line design   1.  PCB EMC wiring design skills When designing the PCB layout design, engineers should fully comply with the design p...

  Abstract: The quality of SMT reflow soldering is affected by many factors. The most important factor is the temperature profile of the reflow oven and the composition of the solder paste during the electronic production process. Here are the most common 17 kinds of reflow soldering defects. Common defects of SMT reflow soldering (1) Incomplete melting of solder paste-there is unmelted residual solder paste around all or part of the solder joints. (2) Poor wetting-also is known as non-wetting or semi-wetting. The solder ends of the components, pins or printed circuit board pads are not wetted or partially not soldered. (3) Insufficient amount of material and false welding or open circuit-the height of the solder joint does not meet the specified requirements, which will affect the mechanical strength of the solder joint and the reliability of the connection. In severe cases, it will cause false welding or open circuit. (4) Bridge and displacement-suspension bridge r...

  Table of Contents 1. The difference between names of PCB ENIG and PCB gold plating 2. The difference in the craftsmanship of PCB ENIG and PCB gold plating 3. The impact on the PCB assembly 4. The impact on electrical function 5. How to identify the PCB ENIG and PCB gold plating 6. Advantages and disadvantages   1. The difference between names of PCB ENIG and PCB gold plating A. Immersion gold is mostly used to call this ENIG (Electroless Nickle Immersion Gold) surface treatment method. The advantage is that nickel and gold can be attached to the copper skin without the use of an electroplating process, and its surface is flatter than electroplated gold. This is especially important for increasingly shrinking electronic parts and components that require flatness. Because PCB ENIG uses a chemical replacement method to produce the effect of the surface gold layer, the maximum thickness of the gold layer cannot reach the same thickness as electroplated gold, and the more the bot...

  Abstract: Custom PCB Assembly is a complicated process. From confirming orders, then making production to final shipment, coordination and cooperation of various departments are required. During the production, due to improper operation by employees or equipment. It is easy to produce welding defects of the product, so the processing process requires strict quality control methods. PCB Assembly  quality control methods as following 1. Make production documents and check it strict Perform DFM manufacturability analysis on customer PCB, BOM, schematic, 3D drawings, assembly manuals and so on, follow check one by one: a) Check the document version and final repair time b) Process: environmental protection C) If marking of the directional components on the PCB silkscreen, and the patch coordinate file are complete and clear d) Whether the model, brand, and silkscreen mark of electronic components in the BOM are complete and clear e) Prototype P...